441 Oracle jobs in Medford, NY
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SynapOne

Medford, NY

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IC Package Designer

Data Device Corporation

Bohemia, NY 11716

$130,000-$170,000/yr
~ 18 min Onsite

  • Bachelor's degree in Electrical Engineering, Material science or related field
  • 8+ years of experience in IC package design and development
  • Proven experience with advanced packaging technologies (e.g., 2.5D/3D, redistribution layer, interposers, HBM integration, Package-in-Package, Fan-Out Wafer Level Packaging, wire bonded, Flip Chip, stacked die using DAF or FOW, Chip-on-Wafer-on-Substrate, Ceramic Co-Fire, Printed Substrate in ceramic package, plastic encapsulated modules/BGAs)
  • Experience with package design tools from concept through release (e.g., Cadence Allegro package designer)
  • Strong understanding of substrate technologies (e.g., BT laminate, ABF, BeO, PTFE, KPPE, glass cloth resin), materials and manufacturing processes
  • Strong verbal and written communication skills, with the ability to work effectively in a team-oriented environment
  • Excellent analytical and troubleshooting skills with a keen eye for detail
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