Oracle Jobs, Employment in Medford, NY Now Hiring October 2025

SynapOne

Medford, NY

Data Device Corporation

Bohemia, NY 11716

Bachelor's degree in Electrical Engineering, Material science or related field
8+ years of experience in IC package design and development
Proven experience with advanced packaging technologies (e.g., 2.5D/3D, redistribution layer, interposers, HBM integration, Package-in-Package, Fan-Out Wafer Level Packaging, wire bonded, Flip Chip, stacked die using DAF or FOW, Chip-on-Wafer-on-Substrate, Ceramic Co-Fire, Printed Substrate in ceramic package, plastic encapsulated modules/BGAs)
Experience with package design tools from concept through release (e.g., Cadence Allegro package designer)
Strong understanding of substrate technologies (e.g., BT laminate, ABF, BeO, PTFE, KPPE, glass cloth resin), materials and manufacturing processes
Strong verbal and written communication skills, with the ability to work effectively in a team-oriented environment
Excellent analytical and troubleshooting skills with a keen eye for detail

Provisions Group

Medford, NY

Barrington James

Islip, NY 11751

Uber

Westport, CT 06880

A valid U.S. driver's license and vehicle insurance
21 years old or older
A 4-door vehicle
At least one year of driving experience in the U.S. (3 years if you're under 23 years old)