Intern 2020 Mechanical Engineering @ ASML/CymerPosted: 18.05.2026Job reference: 0870d9c4aa86ceffb341e77011c359adJob InformationListing type: BasicEU work permit required: NoInternship Goals and ObjectivesWork in a team environment alongside local experienced engineers. Specific tasks will be tailored to match the education/experience level of the intern as well as the intern's learning objectives for the summer.The project will involve design, testing, and integration of real Tin mitigation hardware that is critical for the development of our next‑generation EUV source. The goal of the internship is to learn how to work in a corporate setting and to provide hands‑on experience solving real‑world problems in a team environment.Interns will be required to document and present their findings, and to give an end‑of‑summer presentation to the group about what they achieved.Job MissionASML is the world's leading semiconductor lithography machine manufacturer. We design, develop, integrate, market, and service advanced machines that enable chip manufacturers to produce cheaper, faster, more powerful chips. These machines require high‑speed, magnetically levitated stages with sub‑nanometer accuracy, robotic mask delivery systems, mechatronic devices to shape and correct laser illumination, and optical modules to detect sub‑nanometer alignment errors. Operating in extreme environments—temperature controlled to milli‑kelvins, particulate free, and vacuum—poses endless technical challenges that demand expertise in servo controls, mechatronics, mechanical, electrical, embedded software, optics, physics, manufacturing, industrialization, and more. If you thrive on extreme challenges and want to help bring the next generation of technology to the world, join ASML.Job DescriptionInternship goals: work in a team with experienced engineers, tailored tasks based on your educational and experiential background, and a focus on learning in a corporate environment.Key responsibilities include designing, testing, and integrating Tin mitigation hardware for the next‑generation EUV source, documenting findings, and presenting results to the team.#J-18808-Ljbffr