About the ResearchModel and simulate useful 3D RF structures intended for manufacturing on direct-write tools that have integrated pick‑n‑place and milling capabilities. The project requires the RF structures to be tested, verified, and optimized with simulations such as HFSS. Knowledge on manufacturing volumetric circuits is a requirement to complete this project.OrganizationDEVCOM Army Research LaboratoryReference CodeARL-C-SEDD-300097Research AreaThe Sensors and Electronic Directorate (SEDD) is the Army's principal center for research and development in the exploration and exploitation of the electromagnetic spectrum, including radio frequency, microwave, millimeter‑wave, infrared, visible, and audio. The project focuses on advanced RF circuit manufacturing and simulation.ResponsibilitiesModel and simulate 3D RF structures for direct‑write manufacturing.Test and verify RF prototypes.Optimize designs using simulation tools such as HFSS.Apply knowledge of volumetric circuit manufacturing.Eligibility and QualificationsU.S. Citizen only.Doctoral degree required.Age 18 or older.Preferred disciplines: Electrical and Electronic Engineering (including Cybersecurity) or Engineering General.ContactHarvey Tsang — harvey.h.tsang.civ@mail.mil#J-18808-Ljbffr