Previous experience in Industrial/Manufacturing Engineering tasks; including internship and/or project teams experience.
Prior experience in all aspects of circuit card assembly for plated-thru-hole (PTH) and surface mount technology (SMT) production including component forming, pick-and-place equipment, solder printing, hand soldering, wave soldering, selective-soldering, conformal coating, automated optical inspection, x-ray inspection, and programming of related assembly equipment.
Ability to read & interpret drawing requirements to develop work instructions.
Familiarity with lean/six-sigma manufacturing methods, root cause/corrective action techniques, and IPC-610, IPC-620, J-STD-001.
Demonstrated ability to create/change work instructions, shop floor routers, and bills of materials.
Demonstrated use of 2D and 3D modeling programs such as Auto-CAD and CREO to design tooling/fixturing.