Bachelor's degree in Electrical Engineering, Electronic Engineering, or a related discipline, or equivalent industry experience
Expertise designing complex, high density multilayer PCBs for aerospace, defense, networking, telecommunications, embedded computing, automotive, or other high performance electronic products
2+ years of professional PCB layout experience using enterprise class PCB design tools
Experience with Mentor Xpedition Layout, DxDesigner, and associated design libraries and constraint management tools
Proven experience translating electrical schematics into manufacturable PCB layouts in close collaboration with hardware engineers
Strong background designing high speed digital PCBs, including DDR4/DDR5, GDDR, PCI Express Gen4/Gen5, Gigabit and high speed Ethernet, Fibre Channel, SerDes, controlled impedance routing, and differential pair routing
Experience designing dense multilayer boards, typically 14 to 24 or more layers, or equivalent complexity, using both manual and auto-assisted routing techniques
Strong knowledge of HDI PCB technologies, including blind and buried vias, via-in-pad, sequential lamination, microvias, and advanced stack-up construction
Hands on experience with BGA, fine pitch BGA, QFN packages, high pin count FPGA layouts, surface mount and through hole technologies, and rigid or rigid-flex PCB designs
Strong understanding of signal integrity (SI), power integrity (PI), PCB fabrication and assembly processes, and DFM, DFA, and DFT principles
Experience creating fabrication, assembly, and manufacturing documentation, and validating design quality prior to release
Must be a U.S. Citizen or Green Card holder
Visa sponsorship is not available for this role
