Active DoD Secret (or higher) security clearance.
Advanced degree in Mechanical or Aerospace Engineering with a concentration in *Heat Transfer and Fluid Dynamics*.
Hands‑on experience (2+ years) with one or more of the following tools: *ANSYS Icepak, ANSYS Thermal Desktop, ANSYS Fluent*, or similar electronics cooling / thermal analysis codes.
2+ years leading the *end‑to‑end thermal design* of hardware for defense platforms (airborne, ground mobile, ground stationary, or naval), from requirements definition through verification.
Proven experience advising programs on *system‑level thermal trades* and collaborating within multidisciplinary teams (systems, mechanical, RF, electrical, reliability) from concept through detailed design.
2+ years of experience designing hardware to meet *transient thermal conditions*
Experience advancing *next‑generation electronics thermal management* solutions (e.g., high heat‑flux interfaces, two‑phase or advanced convective cooling, compact high‑power electronics).
Knowledge of *advanced convective and two‑phase thermal management* for high heat‑flux / high power‑density applications, including analytical, high‑fidelity numerical, and experimental methods.
Prior experience leading thermal design at multiple levels of integration (system, chassis, CCA, and microelectronics) for defense or aerospace hardware.
Experience planning and executing *thermal design verification testing*, including correlation of analysis to test data and updating models based on results.
