Bachelors' degree in Industrial Engineering, Manufacturing Engineering, Mechanical Engineering, Electrical Engineering, Science, or equivalent
Five+ years of electronics manufacturing engineering experience preferably in a microelectronics or semiconductor production environment
Demonstrated and tactical level experience or program management of wire bonding for Integrated Power Electronics Modules (IPEM) in the electronics or automotive industries
Ability to design fixtures for soldering and wire bonding
Ability to own multiple, but smaller scale design of experiments (DOEs) on a continual basis, as necessary
Proficient in 8 disciplines of problem solving (8D) analysis
Demonstrated ability to design and test within the tooling feedback cycle
Robust knowledge of SolidWorks required
Ability to demonstrate good judgment in selecting best practice methods and techniques for manufacturing
Proven professional skills as an experienced manufacturing engineer with a full understanding of industry practices and company policies and procedures
Knowledge of IPC-610 standards
Understanding of electrostatic discharge (ESD) protocols
Ability to solve complex technical problems independently
Ability to manage multiple projects at one time
Demonstrated ability to perpetuate and display great interpersonal skills in all forms of communication
Experience working with solder alloys, adhesives and encapsulants, and aluminum wire
Experience with soldering, encapsulant, and adhesive process and equipment
Experienced in application of the process capability index (Cpk) and statistical process control (SPC) data during DOE installation, and execution
Experience influencing and negotiating in complex situations
