Must be a U.S. Citizen.
High School Diploma or equivalent.
5+ years of experience in microelectronics, RF electronics, aerospace, defense, semiconductor, or related high-reliability manufacturing environments.
Demonstrated experience performing optical microscopy inspections.
Proven ability to read and interpret engineering drawings, source control drawings, process documentation, and specifications.
Experience using precision inspection equipment and measurement tools.
IPC-A-610, Acceptability of Electronic Assemblies
IPC-A-600, Acceptability of Printed Boards
MIL-STD-883 Method 2009, Package Inspection
MIL-STD-883 Method 2010, Low and High Power Visual Inspection
MIL-STD-883 Method 2011 and 2023, Wire Bond Testing
MIL-STD-883 Method 2017, Internal Visual Inspection
MIL-STD-883 Method 2019, Die Shear Testing
Security Clearance required: Yes