Experience with SMT equipment, stencil printing, solder paste, reflow soldering, AOI, SPI, and PCB assembly strongly preferred.
Experience with wire bonding processes (wedge and/or ball bond) and bond pull/shear testing.
Familiarity with die attach processes and epoxy selection/curing characteristics.
Strong understanding of hand and machine soldering to J-STD-001/IPC-A-610 standards with components down to 0201 as well as BGA and QFNs.
IPC certifications (e.g. J-STD-001, IPC-A-610, IPC/WHMA-A-620) is a bonus.
Experience with hermetic package assembly and seal processes.
Experience programming and operating Onyx (or similar) automated solder stations.
Knowledge of hermeticity testing (fine/gross leak) and related acceptance criteria and familiarity with hydrogen getter materials and their role in hermetic package moisture control.
Familiarity with common MIL standards and their application.
Experience supporting DoD or aerospace programs and familiarity with AS9100 quality systems as well as ESD protocols.
Experience with mechanical environmental screening such as shock, vibration, temperature cycling and burn in.
Six Sigma Certification.