Experience with precision machining, grinding/lapping, polishing, metallization, bonding, joining, cleaning, inspection, leak testing, pressure testing, or thermal assemblies is preferred
Experience with semiconductor, advanced packaging, electronics cooling, liquid cold plates, ceramics, diamond materials, or high-reliability engineered products is preferred
Strong interpersonal, teaming, and problem-solving skills
Strong technical judgment in reliability testing, materials behavior, thermal-mechanical stress, liquid cooling assemblies, and package-level qualification
Ability to research standards, assess customer requirements, and create practical qualification plans for new technologies
Ability to communicate technical findings clearly to internal teams, customers, suppliers, and external test labs