1639 Electrical Level jobs in Dallas,TX

Full-Time Salary Range: $107359 - $182510

Monetary or non-monetary recognition awards

Other incentives may be available based on position level and/or job specifics.

Health, dental, and vision insurance

Health savings accounts

A 401(k) savings plan

Disability coverage

Life and accident insurance

An employee assistance program

A legal plan

Discounts on things like home, auto, and pet insurance

Paid time off

Paid holidays

Paid parental, military, bereavement, and any applicable federal and state sick leave

Bachelor's degree in electrical engineering

Minimum of four years of relevant experience in related industry (i.e. defense, electronics) or two years with a master's degree

Solid understanding of fundamentals of digital, analog, power, and mixed-signal electronics and interface/communication standards such as UART, SPI, QSPI, I2C, USB, Ethernet, ARINC 429, MIL-STD-1553, PCIe

Experience with the SOSA standard for 3U and 6U VPX module design.

PCB/CCA design experience for 3U or 6U VPX and other form factors.

Proficient at testing and troubleshooting analog, digital, and power supply-based circuits in a lab setting using oscilloscopes, bench supplies, vector network analyzers, spectrum analyzers, frequency counters, arbitrary waveform generators, function generators, logic analyzers

Master's degree in electrical engineering, RF Engineering, or equivalent

Familiarity designing with FPGAs, System-On-Chips (SoC), and/or CPLDs using VHDL and/or Verilog

Familiarity designing and writing embedded SW for microcontroller-based systems and modules

Knowledge of system level EMI mitigation techniques along with proper grounding/shielding architecture

Experience with high-speed mixed signal HDI PCB design, constraints management, and proper routing for interfaces with lane rates up to 25Gbps

Understanding of SPICE simulators and simulation methods, preferably using LTSpice, TINA, PSpice Experience with the following PCB and CCA design features: micro-via and blind/buried vias, stacked micro-vias, via-in-pad and via fill/cap processes, controlled impedances, back drilling, high pin count / fine-pitch BGAs, Chip-on-Board (COB), QFNs/DFNs, LGAs, and other advanced IC package types

Familiarity with Signal Integrity and Power Integrity, as it applies to proper layout techniques

Ability to obtain a DoD Security Clearance - Secret