Master's degree in Electrical Engineering, RF Engineering, or equivalent.
Experience with LabVIEW (or comparable test-automation) for hardware verification and debugging.
Experience with PCB/CCA design for 3U or 6U VPX or other standard form factors.
Experience with the SOSA standard for 3U and 6U VPX module design.
Familiarity designing with FPGAs, System-On-Chips (SoC), and/or CPLDs using VHDL and/or Verilog.
Experience designing and writing embedded software for microcontroller-based systems and modules.
Knowledge of system-level EMI mitigation techniques and proper grounding/shielding architecture.
Experience with high-speed mixed-signal HDI PCB design, including constraints management and routing for interfaces with lane rates up to 25Gbps.
Understanding of SPICE simulators and simulation methods (e.g., LTSpice, TINA, PSpice).
Experience with advanced PCB/CCA design features: micro-vias, blind/buried vias, via-in-pad, controlled impedances, back drilling, and high pin count/fine-pitch BGAs.
Familiarity with Signal Integrity (SI) and Power Integrity (PI) as they apply to layout techniques.
Ability to obtain a DoD Security Clearance - Secret.
