466 Adjunct Computer Engineering Technology jobs in Dayton,OH

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Aviation Electronics, Electrical & Computer Systems Technician

U.S. Navy

Wilmington, OH 45177

New, Posted 1 day ago

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Microelectronics Reliability Lab Support Engineer

BOOZ, ALLEN & HAMILTON

Dayton, OH 45433

RemoteEducation AssistanceHealth InsurancePaid Time OffRetirement Benefit

Bachelor's degree in Electrical, Electro-Mechanical, Electronics Engineering, or Engineering Technology
Experience developing and executing test plans and reports to document lab testing results
Experience with semiconductor electronics testing in a laboratory environment
Experience using benchtop equipment, such as oscilloscopes, digital multimeters (DMMs), and microscopes
Experience designing, building, and operating test setups using functional and parametric testing techniques
Experience with MATLAB, Python, or a scripting language for data analysis
Experience preparing and delivering technical briefings and reports to government stakeholders
Ability to work both independently on small projects, and collaboratively in a team environment
Ability to obtain a Secret clearance

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Aviation Electronics, Electrical & Computer Systems Technician

U.S. Navy

Kettering, OH 45459

New, Posted 1 day ago

Permanent Allied-Radiology Tech, CT Scan Tech

StaffDNA

Wilmington, OH 45177

~ 45 min Onsite

Competitive salary and comprehensive benefits package.

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New, Posted 1 hour ago

CNC Machinist Day and Night Shift

FC Industries

Dayton, OH 45424

Flexible Schedule

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Lead Transmission Line Engineer

Leidos

Dayton, OH 45433

Paid Relocation to Dayton, OH

RemoteFlexible SchedulePaid Time OffRetirement Benefit

Bachelor's degree in Civil, preferred, or Mechanical Engineering with eight plus (8+) years of relevant experience in the design of high voltage electric utility transmission systems.
Expertise in PLS-CADD and PLS-POLE.
Engineer In Training (EIT) certification.

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New, Posted 1 day ago

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Microelectronics Advanced Packaging Engineer

BOOZ, ALLEN & HAMILTON

Dayton, OH 45434

RemoteEducation AssistanceHealth InsurancePaid Time OffRetirement Benefit

2+ years of experience in dynamic manufacturing and R & D environment evaluating new packaging materials, processes, and architectures to align to state-of-the-art
Experience in eCAD and mCAD sof tware
Experience with packaging, PCB fabrication, clea nro om processing, or SMT assembly
Experience developing packaging solutions that optimize Size Weight and Power ( SWaP ) and prototyping designs in a high-mix, low-volume R & D Environment
Experience operating and maintaining complex equipment in microelectronics rapid prototyping laboratories
Experience with the complete packaging assembly processes from concept to prototype including equipment and material selection for panel-level, wafer-level, and chip-level systems
Experience with flip-chip, BGA, WLP, system-in-package SiP, multi-chip modules MCM, panel level packaging, and heterogenous and chiplet integration
Ability to obtain a Secret clearance
Bachelor's degree in an engineering field

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