500 Embedded Software Engineer Engineering jobs in Dayton,OH

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Mechanical/Electrical Engineer Transformer Designer

Westrafo

West Carrollton City, OH 45449

Onsite

Bachelor's or higher degree in Mechanical/Electrical Engineering or related field.
5+ years of experience in mechanical design and development.
Proficiency in mechanical design and simulation tools and 3D CAD software (SolidWorks).
Knowledge of mechanical components, structural materials, thermal systems, and fluid dynamics.
Knowledge of core materials, winding types, insulation systems, electromagnetics, and fluid dynamics.
On-site position in Trotwood, OH
If selected for this role, a drug screen and background check will be conducted.

SmartExplore AI is experimental.

RecruitMilitary

Lead Engineer/Technician

RecruitMilitary Placement Services

Springfield, OH 45503

$40-$45/hr

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Nuclear Engineer

U.S. Navy

Germantown, OH 45327

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Civil Project Manager (Residential)

The Mannik & Smith Group

West Jefferson, OH 43162

Flexible ScheduleEducation AssistanceHealth InsurancePaid Time OffRetirement Benefit

Bachelor's degree in civil engineering or a related field.
Professional Engineer (PE) license, preferably in Ohio, or ability to obtain within 6 months.
8+ years of civil site development experience, with at least 2 years focused on residential land development.
Strong proficiency with AutoCAD Civil 3D (alignments, corridors, grading, profiles, pipe networks).
Demonstrated experience managing clients, projects, budgets, and multi-disciplinary teams.
Knowledge of local development codes, stormwater regulations, and residential design standards.

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Process Engineer

ConAgra Foods

Troy, OH 45373

~ 32 min OnsiteFlexible ScheduleEducation AssistanceHealth InsurancePaid Time OffRetirement Benefit

Proficient in Microsoft Applications (Excel, PowerPoint, Power BI, PowerApps)
Bachelor's degree in engineering
Technical knowledge and understanding of manufacturing systems and equipment

SmartExplore AI is experimental.

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Senior Director of Sales - Precision Machining

Libra Industries Acquisition LLC

Dayton, OH 45404

Minimum of 8–12 years of successful B2B manufacturing services sales experience
Strong working knowledge of CNC machining processes, materials, tolerances, and inspection requirements
Proven track record selling contract manufacturing and machining services for complex products to OEM customers
Demonstrated ability to engage engineering-driven buying organizations
Experience supporting RFQ, supplier qualification, and production ramp programs
Ability to manage complex, multi-stakeholder sales cycles
Strong commercial, negotiation, and presentation skills
Comfortable engaging at both technical and executive levels
Travel to customer sites and internal manufacturing locations. Estimated travel is 40–60%.

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Lead Transmission Line Engineer

Leidos

Dayton, OH 45433

Paid Relocation to Dayton, OH

RemoteFlexible SchedulePaid Time OffRetirement Benefit

Bachelor's degree in Civil, preferred, or Mechanical Engineering with eight plus (8+) years of relevant experience in the design of high voltage electric utility transmission systems.
Expertise in PLS-CADD and PLS-POLE.
Engineer In Training (EIT) certification.

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Sr. Construction Manager, MLZ Data Center Construction

Amazon Data Services

New Carlisle, OH 45344

~ 31 min OnsiteUrgently HiringHealth InsurancePaid Time OffRetirement Benefit

Bachelor's degree in Mechanical Engineering

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Microelectronics Advanced Packaging Engineer

BOOZ, ALLEN & HAMILTON

Dayton, OH 45434

RemoteEducation AssistanceHealth InsurancePaid Time OffRetirement Benefit

2+ years of experience in dynamic manufacturing and R & D environment evaluating new packaging materials, processes, and architectures to align to state-of-the-art
Experience in eCAD and mCAD sof tware
Experience with packaging, PCB fabrication, clea nro om processing, or SMT assembly
Experience developing packaging solutions that optimize Size Weight and Power ( SWaP ) and prototyping designs in a high-mix, low-volume R & D Environment
Experience operating and maintaining complex equipment in microelectronics rapid prototyping laboratories
Experience with the complete packaging assembly processes from concept to prototype including equipment and material selection for panel-level, wafer-level, and chip-level systems
Experience with flip-chip, BGA, WLP, system-in-package SiP, multi-chip modules MCM, panel level packaging, and heterogenous and chiplet integration
Ability to obtain a Secret clearance
Bachelor's degree in an engineering field

SmartExplore AI is experimental.

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