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BS degree in Computer Science or Software Engineering or equivalent experience
Over 10 years of experience including the development of Java-based and messaging-driven applications, with expertise in Spring, Spring Boot, API design, and multi-layered Java/J2EE architectures

Jobot

Salem, NH 03079

US Navy

Newburyport, MA 01950

Adecco

Beverly, MA 01915

Ability to lift up to 50 lbs occasionally
5+ years of manufacturing engineering experience supporting CNC machining operations
Effective communication skills and ability to work independently
Occasional travel may be required
Experience with CNC machining, workholding, and machining principles
Combination of office and manufacturing floor environment
CAD/solid modeling proficiency (SolidWorks preferred)
Familiarity with drawing/dimensioning standards
Full-time, salaried position
Standard business hours, Monday–Friday
Strong knowledge of machine shop and inspection practices
ERP/MRP system experience
Frequent standing, bending, and movement on the shop floor
Visual acuity and manual dexterity for precision-related tasks
BS in Mechanical, Manufacturing, or Industrial Engineering (or equivalent experience)

Gentex Corporation

Manchester, NH 03103

Microchip Technology

Lawrence, MA 01842

Proficiency with automated wire bonding machinery and manual wire bonding techniques
Excellent manual dexterity and hand-eye coordination
Experience using tweezers, vacuum pencils, etc.
High school diploma or equivalent
Ability to work in a fast-paced, team-oriented environment
Ability to wear the required Protective Equipment
Strong understanding of microelectronics and the ability to work with delicate components
Strong problem-solving skills and attention to detail
U.S. Export Controls Requirements: This job requires access to technology, materials, software or hardware that is controlled by the export laws of the United States. Candidates are required to provide proof of either US citizenship, Permanent US residency or classification as a protected individual as defined in 8 USC 1324b (a) (3).
Excellent visual capability to work with extremely small die, without magnification devices
Minimum of 2 years of experience in a wire bonding or semiconductor manufacturing role
Good communication skills, both written and verbal
You must be 18 years old with a high school diploma or GED
Regular and predictable attendance is essential
Ability to read and interpret technical drawings and process specifications