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Software Development Engineer

Fairborn,OH

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509 Software Development Engineer jobs in Fairborn,OH

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Mechanical/Electrical Engineer Transformer Designer

Westrafo

Huber Heights, OH 45424

Onsite

  • Bachelor's or higher degree in Mechanical/Electrical Engineering or related field.
  • 5+ years of experience in mechanical design and development.
  • Proficiency in mechanical design and simulation tools and 3D CAD software (SolidWorks).
  • Knowledge of mechanical components, structural materials, thermal systems, and fluid dynamics.
  • Knowledge of core materials, winding types, insulation systems, electromagnetics, and fluid dynamics.
  • On-site position in Trotwood, OH
  • If selected for this role, a drug screen and background check will be conducted.
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Nuclear Engineer

U.S. Navy

Fairborn, OH 45324

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Sr. Construction Manager, MLZ Data Center Construction

Amazon Data Services

New Carlisle, OH 45344

~ 17 min OnsiteUrgently HiringHealth InsurancePaid Time OffRetirement Benefit

  • Bachelor's degree in Mechanical Engineering
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Sales & Account Management - Entry Level

Globe Life Liberty National - The Kafkis Agencies

Columbus, OH 43230

~ 1 hr 0 min OnsiteUrgently HiringFlexible Schedule

  • Must have reliable transportation
  • Authorized to work in the U.S.
  • In Office position
  • No prior insurance experience is required — only a strong drive to succeed
  • Full-time
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Senior Reliability Engineer Manufacturing

ConAgra Foods

Troy, OH 45373

Requires TravelFlexible ScheduleEducation AssistanceHealth InsurancePaid Time OffRetirement Benefit

  • Bachelor's degree in Engineering
  • 5+ years of manufacturing experience in Reliability Engineering, Maintenance, or Engineering roles, preferably in food, beverage, or CPG.
  • Previous experience implementing Reliability Engineering processes.
  • Proven track record of establishing Reliability Engineering capabilities.
  • Experience managing projects.
  • Excel – Intermediate experience
  • Primary job location options include: Darien WI, Marshall MO, Troy OH, Ft. Madison IA, Council Bluffs IA, Imlay City MI, Archbold OH with 50% travel to our other plant locations
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Lead Transmission Line Engineer

Leidos

Dayton, OH 45433

Paid Relocation to Dayton, OH

RemoteFlexible SchedulePaid Time OffRetirement Benefit

  • Bachelor's degree in Civil, preferred, or Mechanical Engineering with eight plus (8+) years of relevant experience in the design of high voltage electric utility transmission systems.
  • Expertise in PLS-CADD and PLS-POLE.
  • Engineer In Training (EIT) certification.
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RecruitMilitary
Lead Engineer/Technician

RecruitMilitary Placement Services

Springfield, OH 45503

$40-$45/hr
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Training Developer II (Training and Development Specialist)

ONEIL

Miamisburg, OH 45342

Flexible Schedule
New, Posted 1 day ago
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Civil Project Manager (Residential)

The Mannik & Smith Group

Derby, OH 43117

Flexible ScheduleEducation AssistanceHealth InsurancePaid Time OffRetirement Benefit

  • Bachelor's degree in civil engineering or a related field.
  • Professional Engineer (PE) license, preferably in Ohio, or ability to obtain within 6 months.
  • 8+ years of civil site development experience, with at least 2 years focused on residential land development.
  • Strong proficiency with AutoCAD Civil 3D (alignments, corridors, grading, profiles, pipe networks).
  • Demonstrated experience managing clients, projects, budgets, and multi-disciplinary teams.
  • Knowledge of local development codes, stormwater regulations, and residential design standards.
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Microelectronics Advanced Packaging Engineer

BOOZ, ALLEN & HAMILTON

Dayton, OH 45434

RemoteEducation AssistanceHealth InsurancePaid Time OffRetirement Benefit

  • 2+ years of experience in dynamic manufacturing and R & D environment evaluating new packaging materials, processes, and architectures to align to state-of-the-art
  • Experience in eCAD and mCAD sof tware
  • Experience with packaging, PCB fabrication, clea nro om processing, or SMT assembly
  • Experience developing packaging solutions that optimize Size Weight and Power ( SWaP ) and prototyping designs in a high-mix, low-volume R & D Environment
  • Experience operating and maintaining complex equipment in microelectronics rapid prototyping laboratories
  • Experience with the complete packaging assembly processes from concept to prototype including equipment and material selection for panel-level, wafer-level, and chip-level systems
  • Experience with flip-chip, BGA, WLP, system-in-package SiP, multi-chip modules MCM, panel level packaging, and heterogenous and chiplet integration
  • Ability to obtain a Secret clearance
  • Bachelor's degree in an engineering field
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