509 Software Development Engineer jobs in Fairborn,OH

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Mechanical/Electrical Engineer Transformer Designer

Westrafo

Huber Heights, OH 45424

Onsite

Bachelor's or higher degree in Mechanical/Electrical Engineering or related field.
5+ years of experience in mechanical design and development.
Proficiency in mechanical design and simulation tools and 3D CAD software (SolidWorks).
Knowledge of mechanical components, structural materials, thermal systems, and fluid dynamics.
Knowledge of core materials, winding types, insulation systems, electromagnetics, and fluid dynamics.
On-site position in Trotwood, OH
If selected for this role, a drug screen and background check will be conducted.

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Nuclear Engineer

U.S. Navy

Fairborn, OH 45324

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Sr. Construction Manager, MLZ Data Center Construction

Amazon Data Services

New Carlisle, OH 45344

~ 17 min OnsiteUrgently HiringHealth InsurancePaid Time OffRetirement Benefit

Bachelor's degree in Mechanical Engineering

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Sales & Account Management - Entry Level

Globe Life Liberty National - The Kafkis Agencies

Columbus, OH 43230

~ 1 hr 0 min OnsiteUrgently HiringFlexible Schedule

Must have reliable transportation
Authorized to work in the U.S.
In Office position
No prior insurance experience is required — only a strong drive to succeed
Full-time

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Senior Reliability Engineer Manufacturing

ConAgra Foods

Troy, OH 45373

Requires TravelFlexible ScheduleEducation AssistanceHealth InsurancePaid Time OffRetirement Benefit

Bachelor's degree in Engineering
5+ years of manufacturing experience in Reliability Engineering, Maintenance, or Engineering roles, preferably in food, beverage, or CPG.
Previous experience implementing Reliability Engineering processes.
Proven track record of establishing Reliability Engineering capabilities.
Experience managing projects.
Excel – Intermediate experience
Primary job location options include: Darien WI, Marshall MO, Troy OH, Ft. Madison IA, Council Bluffs IA, Imlay City MI, Archbold OH with 50% travel to our other plant locations

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Lead Transmission Line Engineer

Leidos

Dayton, OH 45433

Paid Relocation to Dayton, OH

RemoteFlexible SchedulePaid Time OffRetirement Benefit

Bachelor's degree in Civil, preferred, or Mechanical Engineering with eight plus (8+) years of relevant experience in the design of high voltage electric utility transmission systems.
Expertise in PLS-CADD and PLS-POLE.
Engineer In Training (EIT) certification.

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RecruitMilitary

Lead Engineer/Technician

RecruitMilitary Placement Services

Springfield, OH 45503

$40-$45/hr

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Training Developer II (Training and Development Specialist)

ONEIL

Miamisburg, OH 45342

Flexible Schedule

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Civil Project Manager (Residential)

The Mannik & Smith Group

Derby, OH 43117

Flexible ScheduleEducation AssistanceHealth InsurancePaid Time OffRetirement Benefit

Bachelor's degree in civil engineering or a related field.
Professional Engineer (PE) license, preferably in Ohio, or ability to obtain within 6 months.
8+ years of civil site development experience, with at least 2 years focused on residential land development.
Strong proficiency with AutoCAD Civil 3D (alignments, corridors, grading, profiles, pipe networks).
Demonstrated experience managing clients, projects, budgets, and multi-disciplinary teams.
Knowledge of local development codes, stormwater regulations, and residential design standards.

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Microelectronics Advanced Packaging Engineer

BOOZ, ALLEN & HAMILTON

Dayton, OH 45434

RemoteEducation AssistanceHealth InsurancePaid Time OffRetirement Benefit

2+ years of experience in dynamic manufacturing and R & D environment evaluating new packaging materials, processes, and architectures to align to state-of-the-art
Experience in eCAD and mCAD sof tware
Experience with packaging, PCB fabrication, clea nro om processing, or SMT assembly
Experience developing packaging solutions that optimize Size Weight and Power ( SWaP ) and prototyping designs in a high-mix, low-volume R & D Environment
Experience operating and maintaining complex equipment in microelectronics rapid prototyping laboratories
Experience with the complete packaging assembly processes from concept to prototype including equipment and material selection for panel-level, wafer-level, and chip-level systems
Experience with flip-chip, BGA, WLP, system-in-package SiP, multi-chip modules MCM, panel level packaging, and heterogenous and chiplet integration
Ability to obtain a Secret clearance
Bachelor's degree in an engineering field

SmartExplore AI is experimental.