Gowning to ISO 7 standard is required
Familiarity and comfort in that environment is expected.
Ability to perform technical writing, reading of technical assembly documentation and math functions.
Mechanical aptitude to understand and or be comfortable in dimensioning and spatial reasoning.
Capacity to apply mechanical and physical properties to both assembly and fundamental understanding of materials used in that assembly.
Intermediate computer knowledge, datalogging will require usage of and familiarity with SAP, MS Excel, SharePoint, pivot tables, graphing and charting.
Knowledge and understanding of ESD practices.
Possesses the knowledge and skill set of assembling complex microelectronic systems.
Skills required for hybrid assembly operations of various microelectronic modules including aluminum ultrasonic wedge bonding, manual pick and placement of die and surface mount components as well as die attachment.
The ability to recognize nonconformities is required through self-inspection.
High school diploma
