Comfortable working with various manufacturing and electronics tools: vacuum reflow ovens, wire bonders, solder printers, and EFDs
Demonstrated and tactical level experience or program management of wire bonding for Integrated Power Electronics Modules (IPEM) in the electronics or automotive industries
Ability to design fixtures for soldering and wire bonding
Ability to own multiple, but smaller scale design of experiments (DOEs) on a continual basis, as necessary
Proficient in 8 disciplines of problem solving (8D) analysis
Demonstrated ability to design and test within the tooling feedback cycle
Robust knowledge of SolidWorks required
Knowledge of IPC-610 standards
Understanding of electrostatic discharge (ESD) protocols
Experience working with solder alloys, adhesives and encapsulants, and aluminum wire
Experience with soldering, encapsulant, and adhesive process and equipment
Experienced in application of the process capability index (Cpk) and statistical process control (SPC) data during DOE installation, and execution
Five+ years of electronics manufacturing engineering experience
Bachelors' degree in Industrial Engineering, Manufacturing Engineering, Mechanical Engineering, Electrical Engineering, Science, or equivalent
