Bachelor's degree in Electrical Engineering, Electronic Engineering, or related discipline, or equivalent experience
2+ years of professional PCB layout experience
Strong background in high speed digital PCB design: DDR4/DDR5, GDDR, PCIe Gen4/5, Gigabit/high speed Ethernet, Fibre Channel, SerDes, controlled impedance and differential pair routing
Experience with HDI technologies (blind/buried vias, via-in-pad, sequential lamination, microvias) and dense multilayer stack-ups
Hands on experience with BGA, fine pitch BGA, QFN, high pin count FPGA layouts, and rigid or rigid-flex designs
Strong understanding of signal integrity, power integrity, DFM, DFA, and DFT principles
Experience creating fabrication, assembly, and manufacturing documentation
Must be a U.S. Citizen or Green Card holder