Bachelor's degree in Electrical Engineering
Minimum 8 years of experience in DoD embedded systems and hardware design, including SBC, FPGA, switch, and I/O card development
Extensive experience designing mixed-signal, high-speed digital, analog, and low-power, high-current circuits in high-reliability environments
Strong experience designing high-density interconnect (HDI) PCBs, including complex multi-layer designs, multi-lamination processes, blind/buried vias, and uVia structures
Hands-on experience with Siemens Expedition DX Designer (SCH) and Siemens Expedition PCB tools
Ability to lead technical efforts, prioritize competing tasks, drive execution, and deliver results in high-pressure, schedule-driven environments
Demonstrated experience providing technical leadership, mentoring engineers, and guiding complex hardware designs from concept through production
Strong understanding of hardware architecture, design trade-offs, verification, qualification, and production support
Excellent communication skills with the ability to collaborate effectively with engineering teams, customers, and cross-functional stakeholders
Proficient in Microsoft Office applications (Excel, Outlook, PowerPoint)
US Citizenship required
Active DoD security clearance preferred
