Master's degree in Electrical Engineering, RF Engineering, or equivalent
Familiarity designing with FPGAs, System-On-Chips (SoC), and/or CPLDs using VHDL and/or Verilog
Familiarity designing and writing embedded SW for microcontroller-based systems and modules
Knowledge of system level EMI mitigation techniques along with proper grounding/shielding architecture
Experience with high-speed mixed signal HDI PCB design, constraints management, and proper routing for interfaces with lane rates exceeding 1Gbps
Hands-on experience with high voltage testing with an emphasis on measurement safety
Experience with low noise, wide bandwidth, low power, Analog Front-End systems
Understanding of SPICE simulators and simulation methods, preferably using LTSpice, TINA, PSpice Experience with the following PCB and CCA design features: micro-via and blind/buried vias, stacked micro-vias, via-in-pad and via fill/cap processes, controlled impedances, backdrilling, high pin count / fine-pitch BGAs, Chip-on-Board (COB), QFNs/DFNs, LGAs, and other advanced IC package types
Familiarity with phase/gain margin stability analysis and other small signal analysis techniques, as it applies to analog circuit design and switch-mode power supply design
Familiarity with Signal Integrity and Power Integrity, as it applies to proper layout techniques
Active DoD Security Clearance - Top Secret with SCI