Master's degree in Electrical Engineering, Materials Science, Chemical Engineering, Microelectronics, Physics, Chemistry, or a related area with at least two (2) years of proven experience. A PhD or equivalent experience in these subjects also qualifies if supported by relevant coursework or research related to thin films, interconnect technology, nanofabrication, or similar topics.
Basic knowledge of semiconductor manufacturing techniques (thin film deposition, etch, lithography, CMP)
Familiarity with BEOL concepts: metallization, interconnects, dielectrics, barrier/liner films.
Hands-on experience with one or more thin-film deposition or etch processes, such as chemical vapor deposition, atomic layer deposition, or physical vapor deposition.
Experience with semiconductor device technologies and with at least one of the following: process integration, yield improvement, or reliability testing.