Master's degree in Electrical or Communications Engineering or a related field
7+ years of experience designing full-custom packages/PCBs for high performance chips.
Strong understanding of RF fundamentals such as s-parameters, impedance matching, and passive components such as couplers and transmission lines.
Strong understanding of power integrity fundamentals, including selection and optimization of passives in package.
Experience routing high-speed, high pin count digital and analog interfaces (e.g. SERDES, CPU, memory).
Understanding of package materials properties related to high-volume production and reliability: temperature cycling, HAST, shock, vibration, thermal resistance, outgassing, etc.