Structured ramp-up on fiber handling, splicing, connectorization, and optical cleanliness control if you are coming from an adjacent electromechanical or electro-optical background.
Direct experience with fiber handling, fusion splicing, connectorization, or optical assembly processes.
Familiarity with industry standard end-face pass/fail criteria.
Familiarity with Class 1M/3B laser safety practices in a manufacturing environment.
Experience preparing transfer packages and supporting CM launches, particularly in Asia or Europe.
Experience with ruggedized handheld instruments - enclosure assembly, overmold, battery integration, IP sealing, and drop/environmental qualification.
Experience with modular or configurable product platforms where a common mainframe accepts multiple module configurations.
ERP/PLM system proficiency (SAP, Oracle, Windchill, Agile, or equivalent) for BOM, routing, and change management.
Six Sigma Green/Black Belt, Lean certification, or equivalent continuous improvement credentials.
Use of AI tools for process analysis, documentation development, or manufacturing data analysis.