Master's degree in electrical engineering, RF Engineering, or equivalent
Familiarity designing with FPGAs, System-On-Chips (SoC), and/or CPLDs using VHDL and/or Verilog
Familiarity designing and writing embedded SW for microcontroller-based systems and modules
Knowledge of system level EMI mitigation techniques along with proper grounding/shielding architecture
Experience with high-speed mixed signal HDI PCB design, constraints management, and proper routing for interfaces with lane rates up to 25Gbps
Understanding of SPICE simulators and simulation methods, preferably using LTSpice, TINA, PSpice Experience with the following PCB and CCA design features: micro-via and blind/buried vias, stacked micro-vias, via-in-pad and via fill/cap processes, controlled impedances, back drilling, high pin count / fine-pitch BGAs, Chip-on-Board (COB), QFNs/DFNs, LGAs, and other advanced IC package types
Familiarity with Signal Integrity and Power Integrity, as it applies to proper layout techniques
Ability to obtain a DoD Security Clearance - Secret
