Experience with microwave module level process engineering and/or backend wafer processes (saw, pick, and inspect)
Familiarity with GaAs/GaN MMIC construction and visual inspection criteria
Experience with Manufacturing Execution Systems (MES) & Quality Management Systems (QMS)
For Module level Processing: Paperless MES/QMS
For Wafer / MMIC Processing: @PROMIS MES
Familiarity with manufacturing equipment:Manual Wire Bonders, Bond-Pull/Die Shear Testers, Automated measurement systems, Optical Microscopes, X-Ray machines, Solder Reflow Chambers Ovens (SRO), manual and auto Pick and Place machines, and/or Wafer Dicing Saws
Experienced in current computer applications such as Microsoft Office, and familiarity with 2-D computer aided design (CAD) programs such as AutoCAD.
Familiarity with manufacturing equipment: Manual Wire Bonders, Bond-Pull/Die Shear, Automated measurement systems, X-Ray machines, Solder Reflow Chambers (SRO), manual and auto Pick and Place machines, and/or Wafer Dicing Saws
Lean Six Sigma Greenbelt and/or experience applying Lean Manufacturing and Six Sigma principles to drive measurable improvement
A strong quality mindset and understanding of tools used (such as 8D RCCA, SPC, PFMEA) and relevant standards such as AS9145 (APQP/PPAP)
Dispositioning and further processing of materials at PMRB (rework, repair, regrade, reject, or return to the vendor, no defect found)
Knowledge of Change Orders (CO) and the Product Lifecycle Management System (PLM)