Bachelor of Science in Aerospace or Mechanical, from an ABET Accredited Institution and a minimum of 7 years in Aerospace, Defense or a similarly regulated industry
Experience with MCAD software. SolidWorks is preferred
Must have thorough experience in Electronics Packaging, a minimum of 5 years
Must have familiarity with CCA (Circuit Card Assembly) design and manufacturing
Experience as a Lead Mechanical Engineer on a program, interfacing with IPT Team/PMO/Customer
Must be Proficient in managing schedule and budget
Experience dispositioning Non-Conforming products and providing appropriate solutions
Experience with Engineering Analysis / Hand-Calculations (Thermal/Structural)
Must be familiar with what is required at PDR, CDR, Production, and all the phases and gating processes of a production program
Must be experienced working with Customer Requirements
Mentors and trains entry-level Mechanical Engineers
Experience with Data Management/Configuration Control of Engineering Drawings and BOMs (PDM/PLM)
Experience with ASME Y14.100 and its associated standards (Y14.5, Y14.24, etc...)
Experience with ECAD software is a plus, Altium is preferred
Experience with cable modeling and documentation is a plus
Familiarity with DFM/DFA is a plus
Familiarity with Rapid Prototyping practices (i.e. 3D Printing) is a plus