Destructive Physical Analysis (DPA) or failure analysis
Microsectioning or chemical deprocessing
Military standards, performance specifications, and component-related documentation
Digital multimeters, oscilloscopes, and other electrical test equipment
Printed wiring board (PWB) assembly
IC or hybrid assembly
Plating or other relevant manufacturing processes
Basic chemistry knowledge
Soldering and electronic component work
Technical report writing and documentation
CAD and the ability to read schematic diagrams
Designing custom fixtures for 3D printing
Microsoft Word, Excel, PowerPoint, Adobe Acrobat, Photoshop, or similar documentation/reporting programs
Associate or bachelor's degree in a STEM-related field is preferred but not required.