Jobs2Careers logoHome

Principal Digital Design Engineer

Los Angeles,CA

2614 Principal Digital Design Engineer jobs in Los Angeles,CA

Featured Opportunity
Raytheon Logo

Raytheon - Los Angeles, CA

Senior Principal Systems Engineer (Onsite)

Paid Relocation to Los Angeles, CA

OnsiteFlexible ScheduleHealth InsurancePaid Time OffRetirement Benefit
Apply Directly
Principal Digital CCA Designer

RTX

El Segundo, CA 90245

~ 23 min OnsiteFlexible ScheduleHealth InsurancePaid Time OffRetirement Benefit

The salary range for this role is 118,300 USD - 224,900 USD.
Hired applicants may be eligible for annual short-term and/or long-term incentive compensation programs depending on the level of the position and whether or not it is covered by a collective-bargaining agreement.
Medical, dental, vision, life insurance, short-term disability, long-term disability, 401(k) match, flexible spending accounts, flexible work schedules, employee assistance program, Employee Scholar Program, parental leave, paid time off, and holidays.
Typically requires a Bachelor's Degree in Science, Technology, Engineering or Mathematics (STEM)
8+ years of applicable experience focused on architecting, designing, implementing, and testing digital Circuit Card Assembly (CCA) designs.
Experience with high-speed mixed signal circuit card design and/or high-density, high-speed digital circuit card design.
Experience in bus standards protocol such as: sRIO, SpaceWire, VME, PCI, PCIe, VPX, and Gb Ethernet.
Experience designing hardware boards that house Xilinx and Altera FPGAs.
U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance
The ability to obtain and maintain a U.S. government issued security clearance post-start is required.
10+ years of applicable experience focused on architecting, designing, implementing, and testing digital Circuit Card Assembly (CCA) designs.
Experience managing and presenting technical data to stakeholders and customers in design reviews and technical interchange meetings.
Embedded Software and Firmware knowledge and experience
Experience with Simulation tools such as Symulink, Modelsim; Logic Bus Analyzers, In-Circuit Emulators/Debugger
C or C++, LabView, Matlab
Experience with Electronic Circuit Simulators such as PSpice
Familiar with Failure Analysis and worst-case analysis, HSpice/PSpice, Mentor xDx-Designer Hyperlynx
Masters of Science degree in Electrical Engineering, or Computer Engineering is desirable.
Recommended
Apply Directly
Principal / Sr. Principal Software Engineer (C++ and TS Clearance)

Northrop Grumman

Los Angeles, CA 90011

Paid Relocation to Los Angeles, CA

OnsiteHealth InsurancePaid Time Off

Primary Level Salary Range: $114,000.00 - $171,000.00
Secondary Level Salary Range: $142,200.00 - $213,400.00
Employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay.
Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results.
Employees in Vice President or Director positions may be eligible for Long Term Incentives.
Relocation assistance may be available
Health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.
Active Top Secret security clearance and enrolled in Continuous Evaluation
Ability to meet customer-specific security screening requirements within a timeframe set forth by management
Willingness and ability to work onsite full-time
Experience working in C/C++
Familiarity with modern C++ standards and features (e.g., C++ 17 onwards)
Demonstrated ability to analyze system requirements to derive software design and performance requirements
Proven ability to design and code new software, as well as modify existing software to add new features
Ability to debug existing software and correct defects
Experience with open software/system architecture solutions
Experience with developing and maintaining CI/CD pipelines
Experience with Git-based or other software configuration management tools
Bachelor's degree in a STEM discipline with 5+ years of relative experience; Master's degree in a STEM discipline with 3+ years of relative experience; PhD + 1 year of relative experience
Proven ability to design and code new software or modify existing software to add new features
Bachelor's degree in a STEM discipline with 8+ years of relative experience; Master's degree in a STEM discipline with 6+ years of relative experience; PhD + 4 years of relative experience
U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
Experience leading the performance of tasks on schedule, at cost and achieving specified requirements
Experience with modern C++ standards and features (e.g., C++ 20 onwards)
Experience with containers (Docker, Kubernetes)
Experience with Linux operating systems
Experience with CUDA and GPUs
Experience with high performance numerical/scientific computing, parallel computing
Experience with developing for SWaP-constrained environments
Experience with developing and maintaining CI/CD pipelines
Familiarity with signal-processing algorithms
Familiarity with Agile lifecycle process including Scrum and DevSecOps
Apply Directly
Hardware Digital CCA Designer

RTX

El Segundo, CA 90245

~ 23 min OnsiteFlexible ScheduleHealth InsurancePaid Time OffRetirement Benefit

The salary range for this role is 95,500 USD - 181,700 USD.
Annual short-term and/or long-term incentive compensation programs
Medical, dental, vision, life insurance, short-term disability, long-term disability, 401(k) match, flexible spending accounts, flexible work schedules, employee assistance program, Employee Scholar Program, parental leave, paid time off, and holidays
Typically requires a Bachelor's Degree in Science, Technology, Engineering or Mathematics (STEM)
5+ years of applicable experience focused on architecting, designing, implementing, and testing digital Circuit Card Assembly (CCA) designs.
Experience with high-speed mixed signal circuit card design and/or high-density, high-speed digital circuit card design.
Experience in bus standards protocol such as: sRIO, SpaceWire, VME, PCI, PCIe, VPX, and Gb Ethernet.
Experience designing hardware boards that house Xilinx and Altera FPGAs.
U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance.
7+ years of applicable experience focused on architecting, designing, implementing, and testing digital Circuit Card Assembly (CCA) designs.
Experience managing and presenting technical data to stakeholders and customers in design reviews and technical interchange meetings.
Embedded Software and Firmware knowledge and experience
Experience with Simulation tools such as Symulink, Modelsim; Logic Bus Analyzers, In-Circuit Emulators/Debugger
C or C++, LabView, Matlab
Experience with Electronic Circuit Simulators such as PSpice
Familiar with Failure Analysis and worst-case analysis, HSpice/PSpice, Mentor xDx-Designer Hyperlynx
Masters of Science degree in Electrical Engineering, or Computer Engineering is desirable.
Apply Directly
Senior Principal Software Security Engineer

Raytheon

Los Angeles, CA 90011

OnsiteFlexible ScheduleEducation AssistanceHealth InsurancePaid Time OffRetirement Benefit

The salary range for this role is 132,400 USD - 251,600 USD.
Hired applicants may be eligible for annual short-term and/or long-term incentive compensation programs depending on the level of the position and whether or not it is covered by a collective-bargaining agreement.
Healthcare, wellness, retirement and work/life benefits
Career development and recognition programs
Parental (including paternal) leave
Flexible work schedules
Achievement awards
Educational assistance
Child/adult backup care
Medical, dental, vision, life insurance, short-term disability, long-term disability, 401(k) match, flexible spending accounts, flexible work schedules, employee assistance program, Employee Scholar Program, parental leave, paid time off, and holidays.
Active and transferable U.S. government issued security clearance is required prior to start date.
U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance
Ability to obtain INTERIM U.S. government issued security clearance is required prior to start date
Typically requires a Bachelor's in Science, Technology, Engineering, or Mathematics (STEM) AND a minimum of 10 years of relevant software experience
Experience with C / C++
Experience with Xilinx UltaScale+ MPSoC, Versal, or similar Embedded Processors
Experience with embedded OS like VxWorks, Embedded Linux, or similar
Embedded Software Security experience
The ability to obtain and maintain an Interim Secret Level U.S. security clearance is required prior to start date with the ability to obtain program access after start .
Experience with validation and verification of software applications
Linux/Unix environment
Interfacing with FPGAs
Interfacing with low-level memory drivers
Inter-processor communication
ARM Architecture
Secure boot concepts
Cryptographic Algorithms
Experience designing, implementing, testing, or fielding real-time security-oriented solutions on Department of Defense (DoD) programs (embedded experience highly preferred)
Experience using security-relevant tools and devices for security auditing, network security, host/server security, communication security, or policy management.
Experience in Agile and DevSecOps environments
Experience in an Agile/Scrum/Kanban frameworks and development environments
Experience using software configuration management and bug tracking tools
Experience with Python / Perl
PCIe, GPIO, I2C, SATA
Field Programmable Gate Arrays (FPGAs)
Application-Specific Integrated Circuits (ASICs)
ZipRecruiter
Civil Associate Engineer in Land Development

Cannon

Los Angeles, CA 90064

New, Posted 3 hours ago
ZipRecruiter
Electrical Engineer - Circuit Design and Power Electronics (Defense Startup)

iLocatum

Los Angeles, CA 90079

$150,000-$220,000/yr
New, Posted 1 day ago
Apply Directly
Senior Mechanical Design Engineer

Curtiss-Wright

Santa Clarita, CA 91350

$94,700-$126,300/yr
~ 48 min OnsitePaid Time OffRetirement Benefit

$ 94,700.00 - 126,300.00 per year
Competitive Pay
Benefits offerings
Paid Time Off
401K with Employer Match and Profit Sharing
Health and Wellness Benefits
Learning and Development Opportunities
Referral Program
Recognition
Employee Stock Purchase Plan
Bachelor of Science in Aerospace or Mechanical, from an ABET Accredited Institution and a minimum of 7 years in Aerospace, Defense or a similarly regulated industry.
Must have thorough experience in Electronics Packaging, a minimum of 5 years.
Must have familiarity with CCA (Circuit Card Assembly) design and manufacturing.
Experience as a Lead Mechanical Engineer on a program, interfacing with IPT Team/PMO/Customer.
Must be Proficient in managing schedule and budget.
Experience dispositioning Non-Conforming products and providing appropriate solutions is a must.
Must have Experience with Engineering Analysis / Hand-Calculations (Thermal/Structural).
Must be familiar with what is required at PDR, CDR, Production, and all the phases and gating processes of a production program.
Must be experienced working with Customer Requirements.
Experience with Data Management/Configuration Control of Engineering Drawings and BOMs (PDM/PLM).
Experience with ASME Y14.100 and its associated standards (Y14.5, Y14.24, etc...)
This position may require exposure to export-controlled information and subject to additional security screening.
SolidWorks is preferred.
EV training is a plus.
Experience with Hands-On product support/troubleshooting is a plus.
Experience with ECAD software is a plus
Altium is preferred.
Experience with cable modeling and documentation is a plus.
Familiarity with DFM/DFA is a plus.
Familiarity with Rapid Prototyping practices (i.e. 3D Printing) is a plus.
Apply Directly
Manufacturing Engineer

Crane Company

Los Angeles, CA 90011

OnsiteEducation AssistancePaid Time OffRetirement Benefit

$80,000 to $90,000
Some roles may be eligible for participation in performance-based bonus programs
Comprehensive benefits, 401K contribution and match, Paid Time Off, paid holidays, tuition reimbursement and more.
Bachelor's degree in Mechanical, Electrical, or related engineering field
1 to 2 years of manufacturing engineering or related experience
Working knowledge of manufacturing methods, process design, and statistical process control
Experience with DFMEA, ISO 9001, and quality systems
Proficiency with CAD tools in 2D and 3D
Familiarity with machining, assembly, welding, and electro mechanical systems
Exposure to automation, robotics, and PLC programming
Understanding of GD and T and engineering drawings
Knowledge of production processes, materials, and cost drivers
Familiarity with Lean and Six Sigma tools
Experience with Cobots and integration into manufacturing systems
Hands on experience with tools for troubleshooting and equipment calibration
Ability to travel to vendors or customer sites as needed
New, Posted 1 day ago
Apply Directly
Thermal Engineer Level 3 /4 (AHT)

Northrop Grumman

Los Angeles, CA 90011

Paid Relocation to Los Angeles, CA

OnsiteHealth InsurancePaid Time Off

Primary Level Salary Range: $11,400.00 - $171,000.00
Secondary Level Salary Range: $142,200.00 - $213,400.00
Employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay.
Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results.
Employees in Vice President or Director positions may be eligible for Long Term Incentives.
Relocation assistance may be available
Health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.
Full-time
BS degree in Mechanical Engineering, Aerospace Engineering, Thermal Sciences, or a closely related field with 5 years of thermal engineering experience on aerospace or defense missile programs (design, analysis, or testing) or MS degree with 3 years of experience in the same.
Proficiency with thermal‑analysis software such as FLUENT, FEMAP or SINDA, or equivalent tools.
Hands‑on experience with thermal‑vacuum chambers, hot‑fire rigs, high‑temperature ovens, and temperature‑measurement instrumentation (thermocouples, RTDs, IR cameras).
Familiarity with MIL‑STD‑810, MIL‑STD‑461, and other defense‑related thermal‑safety standards; ability to prepare compliance documentation.
Strong grasp of heat‑transfer fundamentals: conduction, convection, radiation, and phase‑change processes.
Ability to obtain and maintain a US Government DoD Secret security clearance
BS degree in Mechanical Engineering, Aerospace Engineering, Thermal Sciences, or a closely related field with 8 years of thermal engineering experience on aerospace or defense missile programs (design, analysis, or testing) or MS degree with 6 years of experience in the same.
U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
Current US Government DoD Secret Security Clearance
SINDA skill plus
Knowledge of MINIVER or other aero heating codes a plus
Missile Weight and Balance Certification
Automated Weight and Balance System (AWBS) experience
Experience with mass property and weight and balance analysis.
Profile builder
Answer questions related to your search and surface your matches.
Browse Jobs
  • Jobs in Top Cities
  • Jobs by State
  • Jobs by Title
  • Jobs by Category
Tools
  • Free Resume Builder
  • Jobs2Careers+ Extension
Company
  • Post a Job
  • About
  • Advice
  • Contact
Jobs2Careers Powered by Talroo© 2026 Jobs2Careers
Logos provided by Logo.dev
© 2026 Jobs2Careers
Privacy PolicyTerms of UseYour Privacy ChoicesCalifornia Consumer Privacy Act (CCPA) Opt-Out Icon
Jobs2Careers Powered by Talroo