High school diploma or equivalent
Minimum of 2 years of experience in a wire bonding or semiconductor manufacturing role.
Proficiency with automated wire bonding machinery and manual wire bonding techniques.
Ability to work with delicate components.
Ability to read and interpret technical drawings and process specifications.
Ability to navigate and utilize a computer to perform job activities.
Excellent manual dexterity and hand-eye coordination
Excellent visual capability to work with extremely small die, without magnification devices.
Experience using tweezers, vacuum pencils, etc.
Candidates are required to provide proof of either US citizenship, Permanent US residency or classification as a protected individual as defined in 8 USC 1324b (a) (3).
Able to lift, push, pull 25 lbs; carry 15 lbs; sit 10%; stand 60%; walk 40%; must be able to perform activities that include stooping, reaching, handling, hearing, talking, seeing, working alone and working around others.