Bachelor's degree in Manufacturing or Industrial Engineering, or a related Science, Engineering or Mathematics field, plus a minimum of 5 years of relevant experience; or Master's degree plus a minimum of 3 years of relevant experience.
A Bachelor's degree in Manufacturing or Industrial Engineering, a related specialized area or field (or equivalent experience) plus a minimum of 5 years of relevant experience; or Master's degree plus a minimum of 3 years of relevant experience
Applicants selected may be subject to a U.S. Government security investigation and must meet eligibility requirements for access to classified information.
U.S. citizenship is required.
Fully proficient use and understanding of Design for Manufacture (DFM) concepts, principles, and theories
Fully proficient understanding lean techniques and statistical analysis
Demonstrated experience supporting Surface Mount Technology (SMT) manufacturing processes, including solder paste printing, component placement, reflow, AOI, inspection, and rework
Working knowledge of materials used in electronics assembly, including solder paste, flux, adhesives, epoxies, conformal coatings, underfill, encapsulants, potting compounds, thermal interface materials, and cleaning chemicals
Ability to review and follow material requirements, technical data sheets, handling instructions, cure profiles, shelf-life controls, and environmental-storage requirements
Experience selecting, applying, and troubleshooting assembly materials to ensure product quality, reliability, and manufacturability
Familiarity with material controls such as ESD requirements, moisture sensitivity level (MSL) handling, lot traceability, expiration-date management, and bake-out requirements