Bachelor of Science in Aerospace or Mechanical, from an ABET Accredited Institution and a minimum of 7 years in Aerospace, Defense or a similarly regulated industry.
Must have thorough experience in Electronics Packaging, a minimum of 5 years.
Must have familiarity with CCA (Circuit Card Assembly) design and manufacturing.
Experience as a Lead Mechanical Engineer on a program, interfacing with IPT Team/PMO/Customer.
Must be Proficient in managing schedule and budget.
Experience dispositioning Non-Conforming products and providing appropriate solutions is a must.
Must have Experience with Engineering Analysis / Hand-Calculations (Thermal/Structural).
Must be familiar with what is required at PDR, CDR, Production, and all the phases and gating processes of a production program.
Must be experienced working with Customer Requirements.
Experience with Data Management/Configuration Control of Engineering Drawings and BOMs (PDM/PLM).
Experience with ASME Y14.100 and its associated standards (Y14.5, Y14.24, etc...)
This position may require exposure to export-controlled information and subject to additional security screening.