726 Process Engineer Epi jobs in Portland,OR

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Intel Foundry Module Development Engineer

Intel

Portland, OR 97204

HybridHealth InsurancePaid Time OffRetirement Benefit

The candidate must possess a Ph.D. degree in Materials Science, Chemical Engineering, Chemistry, Physics, Mechanical Engineering, Electrical Engineering, or a related Scientific STEM (Science Technology Engineering Math) field of study.
Plus 7+ years of Semiconductor industry experience.
Overlay Development Requirements
7+ years of professional overlay development experience and understanding of process induced overlay impacts
Proven experience with integrated process development to co-optimize the process and overlay mark design
Proven experience troubleshooting process impacts to overlay mark performance
Proven experience driving integrated process change methodologies based on overlay impacts
Overlay equipment development and vendor interaction experience is a plus
Experience with ASML scanner EUV and DUV platforms is a plus
Ability to troubleshoot complex production issues and optimize application performance and reliability
Factory Requirements
Understanding of modern semiconductor manufacturing processes
Working knowledge of how modern lithography equipment operates, including the automation systems used to control it
Familiarity with factory automation or manufacturing control systems is a plus

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Applied Early Career Program - Field Service Engineer

Applied Materials

Hillsboro, OR 97124

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Manufacturing Engineering Co-op

Schneider Electric

Tualatin, OR 97062

$22.50-$27/hr

~ 24 min Onsite

Applicants must be authorized to work in the United States on a full-time, ongoing basis.
The company does not provide immigration sponsorship now or in the future.
The expected pay range is USD $22.50-$27.00 per hour.

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Manufacturing Engineer

Precinmac

Tualatin, OR 97062

~ 24 min OnsiteHealth InsurancePaid Time OffRetirement Benefit

Bachelor's degree in engineering or engineering technology (preferably Manufacturing, Industrial or Mechanical).
Minimum of 5 years of engineering experience in a manufacturing environment preferably in a Manufacturing or Process Engineering role.
Experience with and trained in Lean methodologies, including but not limited to; 5S, SMED, VSM, Visual Management / Visual Factory, Problem Solving (A3), Standard Work, Mistake-Proofing, and TPM.
Green or Black Belt level certification in Lean or Lean Six Sigma from a reputable training provider.
Hands on experience with machining processes, preferably with multi-axis milling and turning.
Experience using ERP and MES software, preferably Infor10 ERP (Syteline) and ShopVue.
Proficient with Microsoft Office Suite with strong MS Excel skills.

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Process Engineer

Canon U.S.A.

Hillsboro, OR 97124

Flexible Schedule

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Applied Early Career Program - Field Service Engineer

Applied Materials

Hillsboro, OR 97124

Paid Relocation to Hillsboro, OR

Requires Travel

Associate degree, recent college graduate, military technical training, trade certification, or equivalent hands-on experience
Basic mechanical aptitude and interest in technical systems
Willingness to learn and read electrical and mechanical schematics
Ability to diagnose and solve basic technical problems
Strong written and verbal communication skills
Basic working knowledge of Microsoft Excel, Word, and PowerPoint
Valid driver's license and ability to obtain a passport, if required for travel
Ability to meet on-site safety, environmental, and customer requirements

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Digital Engineering Subject Matter Expert (SME)

System Innovation

Portland, OR

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Hardware Engineer

Actalent

Tualatin, OR 97062

$60-$70/hr

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Advanced Packaging Dry Etch Module Development Engineer

Intel

Hillsboro, OR 97124

~ 34 min OnsiteUrgently HiringHealth InsurancePaid Time OffRetirement Benefit

Master or PhD degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field.
Master's degree with at least 4 years of experience, or PhD with at least 2 years of experience.
Process development engineering within semiconductor manufacturing, including wafer-level assembly or advanced packaging processes.
Design of Experiments (DOE), process development methodology, statistical process control, and/or manufacturing process improvement.
Experience with plasma etch equipment platforms

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