Bachelor's degree in any engineering discipline.
Multi-layer Flex and Rigid-flex circuits experience.
Complex Multi-layer PWB utilizing high-speed materials, featuring microstrip, strip line, and differential routing, controlled impedance, mix of low-noise RF/analog circuitry.
Digital designs with various pin counts and fine-pitch BGAs, RF transmission lines, matched lengths, and delay control lengths.
Experience with JTAG, RGMI, DSP, DDR, LVDS, SERDES, and Ethernet design.
RF layout development with partitioning of circuits utilizing shields, specific mounting, and grounding requirements. All design criteria defined by engineering specifications.
Knowledgeable with hierarchical schematics and layout reuse schemes is a plus.
Familiarity with SI/PI simulation tools, constraint-driven design, and automation or scripting
Experience supporting rapid development cycles, prototype iteration, and production ramp-up
Exposure to space, aerospace, automotive, or other high-reliability hardware environments