Must have experience with a broad range of assembly processes including epoxy die attach, eutectic solder attach, wire bonding, gap welding, pull testing and rework capability.
5 years of related microelectronics assembly experience.
Significant work utilizing a microscope.
Only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position.