Ph.D. or MS degree in Electrical Engineering, Photonics, Optical Engineering, Physics, or Material Science.
Deep understanding of semiconductor physics, optoelectronic device behavior, and cleanroom microfabrication processes.
Experience with optical bench testing, fiber alignment equipment, and semiconductor packaging tools
8+ years of experience in optical communication systems, photonics technologies, and/or electronics manufacturing (preferably in high-tech or semiconductor industries.
Optical transceivers, silicon photonics, CPO, OCS, and fiber-optic communication.
High-speed optical module development (100G/400G/800G/1.6T).
Optical packaging, DSP, signal integrity, and thermal management.
Manufacturing process optimization, quality control, and production line support.
Familiarity with Lean Manufacturing, Six Sigma, statistical analysis tools (Minitab, Power BI), and advanced Microsoft Excel.
Willingness to travel and provide occasional off-hours support for production needs.
Physical ability to perform manufacturing floor tasks (standing/walking for extended periods, lifting up to 40 lbs with buddy system support, wearing required PPE).