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Full Time Engineering

Springfield,OH

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620 Full Time Engineering jobs in Springfield,OH

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Construction Yard Tech - No Weekends

EquipmentShare

Grove City, OH 43123

~ 52 min OnsiteUrgently HiringHealth InsurancePaid Time OffRetirement Benefit

  • Safety training required and PPE required when applicable
  • Occasional lifting may be required, up to 50 lbs
  • Valid driver's license
  • High School diploma or equivalent
  • Must be able to be outside during extreme temperatures
  • Must be able to stand, sit, bend and stoop
  • Must be able to lift up to 50 lbs
  • This is a safety sensitive position and any offer of employment will be contingent on passing a 10 panel drug screen
  • Must be at least 18 years old to be in EquipmentShare yard
  • Employment is contingent on passing a background check. Additionally, some roles require passing a drug test, depending on the job responsibilities.
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New, Posted 18 hours ago
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Driver gig - Earn at least $1315 by driving 106 trips with Uber

Uber

Vandalia, OH 45377

Flexible Schedule

  • 21 years old or older
  • A 4-door vehicle
  • A valid U.S. driver's license and vehicle insurance
  • At least one year of driving experience in the U.S. (3 years if you're under 23 years old)
SmartExplore AI is experimental.
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Sales & Account Management - Entry Level

Globe Life Liberty National - The Kafkis Agencies

Columbus, OH 43230

~ 51 min OnsiteUrgently HiringFlexible Schedule

  • Must have reliable transportation
  • Authorized to work in the U.S.
  • In Office position
  • No prior insurance experience is required — only a strong drive to succeed
  • Full-time
SmartExplore AI is experimental.
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Culinary Agents
COOK (FULL TIME)

Morrison Healthcare - Premier Health

Dayton, OH 45409

$18/hr
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Call Center Representative - Life Insurance

The Mutters Agency

Columbus, OH 43230

Hybrid~ 51 minFlexible Schedule

  • State and federal laws require licensing to sell certain insurance products.
  • Ability to obtain a license is required.
SmartExplore AI is experimental.
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Winding Technician

Westrafo

Beavercreek, OH 45324

OnsiteRetirement Benefit

  • High school diploma or equivalent
  • Proven experience in a manufacturing or electrical assembly role
  • Proficient in using hand tools and machinery related to winding processes
  • Familiarity with safety standards and practices in a manufacturing environment
SmartExplore AI is experimental.
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Midwest Logistics Systems Dedicated truck driver

Midwest Logistic Systems

Urbana, OH 43078

$1,000-$1,500/wk
$10,000 bonus
~ 21 min OnsiteUrgently HiringHealth InsurancePaid Time OffRetirement Benefit

  • Valid Class A Commercial Driver's License (CDL).
  • Live within 50 miles of Marysville, OH.
SmartExplore AI is experimental.
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Customer Service Enrollment Specialist

The Whittingham Agencies

Fort Wayne, IN 46835

~ 2 hr 40 min OnsiteFlexible Schedule

  • State and federal laws require licensing to sell certain insurance products
  • Ability to obtain a license is required
SmartExplore AI is experimental.
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Press Brake Operator (1st shift)

Adecco

Columbus, OH 43230

$22/hr
~ 51 min OnsiteHealth InsurancePaid Time OffRetirement Benefit

  • High school diploma or GED
  • Reliable attendance
  • Team-oriented attitude
  • Open to training and coaching
SmartExplore AI is experimental.
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New, Posted 22 hours ago
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Microelectronics Advanced Packaging Engineer

BOOZ, ALLEN & HAMILTON

Dayton, OH 45434

RemoteEducation AssistanceHealth InsurancePaid Time OffRetirement Benefit

  • 2+ years of experience in dynamic manufacturing and R & D environment evaluating new packaging materials, processes, and architectures to align to state-of-the-art
  • Experience in eCAD and mCAD sof tware
  • Experience with packaging, PCB fabrication, clea nro om processing, or SMT assembly
  • Experience developing packaging solutions that optimize Size Weight and Power ( SWaP ) and prototyping designs in a high-mix, low-volume R & D Environment
  • Experience operating and maintaining complex equipment in microelectronics rapid prototyping laboratories
  • Experience with the complete packaging assembly processes from concept to prototype including equipment and material selection for panel-level, wafer-level, and chip-level systems
  • Experience with flip-chip, BGA, WLP, system-in-package SiP, multi-chip modules MCM, panel level packaging, and heterogenous and chiplet integration
  • Ability to obtain a Secret clearance
  • Bachelor's degree in an engineering field
SmartExplore AI is experimental.
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