Bachelor's degree in Electrical Engineering (BSEE) or Mechanical Engineering (BSME) required, with a minimum of 5 years of experience in RF and multilayer printed circuit board design.
* Alternatively, a Master's degree in Electrical Engineering (MSEE) with at least 3 years of experience in RF and multilayer printed circuit board design will be considered equivalent.
Strong expertise in the design and development of RF and multilayer printed circuit boards is require
Established experience in designing complex RF and multilayer Printed Circuit Boards, including electrical, mechanical and thermal (via arrays, copper coin, metal backing, etc.) considerations.
Must have demonstrated proficiency and experience using modern CAD/CAM design tools, such as OrCAD, Altium Designer, AutoCAD, DraftSight or equivalent and willingness to learn new software as required to perform job duties.
Ability to customize software used for design of Printed Circuit Boards in order to improve its performance and increase productivity.
Demonstrated strong oral and written communication skills in English.
Business related computer skills including Microsoft Office.
The employee must occasionally lift and/or move up to 10 pounds.
Specific vision abilities required by this job include close vision, and ability to adjust focus.