A Master of Science Degree in a structures related field.
General Software: Simcenter, FEMAP, LS-Dyna, Abaqus, Adams, Solidworks.
FEM Applications: Explicit, Transient, Nonlinear, Multibody Dynamics, Assemblies, Bonded Joints, Thermal Shock.
FEA validation by hand calcs and/or test.
Familiarity with MIL-STD-810, DO-160, NASA, and FAA certification loads and regulations.
Structural Analysis: Bolted and Bonded Joints, Welds, Electronics, Antennas, Fracture and Fatigue.
Thermal and dynamic fatigue analysis of circuit boards and components using Sherlock or Steinberg methods.
Materials: Composites, Ceramics, and other high temperature materials.
Test Support in Statics, Modal, Vibration, Acoustics and Shock.
Programming/Scripting Experience in Python, Matlab or VBA.