Bachelor's degree in STEM field with 5 years of directly related professional working experience or Master's degree in STEM field with 3 years of directly related professional working experience. An additional 4 years of relevant experience could be considered in lieu of a degree.
Drafting and design experience of PCB layout and layer stack-up (analog, digital, RF, mixed signal topologies).
Knowledge of industry specifications and design for manufacturing (DFM) rules for PCB design, fabrication and manufacturing.
Knowledge of PCB design rules and techniques for PCBs with anywhere from 2-20 layers from initial prototype to production.
US Citizen with ability to obtain a US government secret security clearance.
Bachelor's degree in STEM field with 8 years of directly related professional working experience or Master's degree in STEM field with 6 years of directly related professional working experience or PhD in STEM field with 4 years of directly related professional working experience. An additional 4 years of relevant experience could be considered in lieu of a degree.