2+ years of experience in backend engineering, AI automation, or complex systems integration
Proven ability to build and maintain production-grade software with modular separation (e.g., distinct services for data parsing, logic processing, and reporting)
Strong command of at least two major languages (e.g., Python, JavaScript, Go, or Java) and experience working with SQL databases
Practical experience building for live, non-mocked environments and handling multi-turn system interactions
Outstanding attention to detail and the ability to provide clear, high-density technical feedback on complex system behaviors

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Manufacturing Engineer II

PTI Technologies

Oxnard, CA 93030

OnsiteHealth InsurancePaid Time OffRetirement Benefit

Bachelor's degree in Mechanical or Industrial Engineering
3-5 years of experience in a manufacturing environment
Proficiency in CNC programming
Familiarity with machine shop operations
Strong language skills are crucial, as you will need to read and interpret technical documents, write reports, and effectively communicate with managers and clients.
A solid foundation in mathematical concepts, including probability, statistics, and geometry, will be necessary for analyzing production data and estimating requirements accurately.
Proficient in tools like MS Office and SolidWorks

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Manufacturing Engineer III

Mercury Systems

Oxnard, CA 93030

OnsiteEducation Assistance

BS in Chemical Engineering, Materials Science, Mechanical Engineering, Electrical Engineering, or closely related engineering discipline. An engineering degree is required - this position develops processes from first principles, not from existing recipes.
Typically requires 15+ years in microelectronics packaging, hybrid microcircuit assembly, or semiconductor device packaging.
Experience hands -on with at least 4 of the following: eutectic die attach (AuSn or AuGe), epoxy die attach, gold wire bonding, aluminum wire/ribbon bonding, hermetic seal processes (laser weld or seam weld), flip chip processes, substrate metallization/bonding, or MEMS/sensor packaging.
Understanding of thermal management challenges in high-power RF amplifier packaging (50V, 200W+ dissipation, Tj max 175°C) is essential.
Experience transitioning microelectronic assemblies from R&D;/prototype through LRIP to production.
Must be able to articulate specific NPI programs led, including process qualification methodology, FMEA development, and production readiness assessment.
Experience with MIL-PRF-38534 (hybrid microcircuits), MIL-STD-883, or equivalent military/space-grade manufacturing standards.
Understanding of qualification flows, screening sequences, and lot acceptance testing.
Experience in materials characterization (SEM/EDS, XPS/ESCA, CSAM, X-ray, cross-sectioning) for root cause analysis of packaging failures.
Experience leading RCCA investigations.
This position requires you to have or obtain a government security clearance. Security clearances may only be granted to U.S. citizens.

SmartExplore AI is experimental.

New, Posted 14 hours ago