Excellent manual dexterity and hand-eye coordination
Experience using tweezers, vacuum pencils, etc.
Excellent listening skills
Ability to work in a fast-paced, team-oriented environment
Strong understanding of microelectronics and the ability to work with delicate components
Strong problem-solving skills and attention to detail
Prior success working both individually and in a team environment
Basic computer, math and reading comprehension skills
You must be 18 years old with a high school diploma or GED
Good written and verbal communication skills
Proficiency with automated wire bonding machinery and manual wire bonding techniques
Ability to read, comprehend and follow detailed work specifications
Adaptability to frequent change and improvements
Ability to wear the required Protective Equipment
High school diploma or equivalent
Ability to follow written and verbal direction
U.S. Export Controls Requirements: This job requires access to technology, materials, software or hardware that is controlled by the export laws of the United States. Candidates are required to provide proof of either US citizenship, Permanent US residency or classification as a protected individual as defined in 8 USC 1324b (a) (3).
Excellent visual capability to work with extremely small die, without magnification devices
Ability to multi-task while paying careful attention to detail
Minimum of 2 years of experience in a wire bonding or semiconductor manufacturing role
Good communication skills, both written and verbal
Able to lift, push, pull 25 lbs; carry 15 lbs; sit 10%; stand 60%; walk 40%; must be able to perform activities that include stooping, reaching, handling, hearing, talking, seeing, working alone and working around others.
Regular and predictable attendance is essential
Ability to read and interpret technical drawings and process specifications