Bachelor's degree in Mechanical or Industrial Engineering
3-5 years of experience in a manufacturing environment
Proficiency in CNC programming
Familiarity with machine shop operations
Strong language skills are crucial, as you will need to read and interpret technical documents, write reports, and effectively communicate with managers and clients.
A solid foundation in mathematical concepts, including probability, statistics, and geometry, will be necessary for analyzing production data and estimating requirements accurately.
Proficient in tools like MS Office and SolidWorks

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Manufacturing Engineer III

Mercury Systems

Oxnard, CA 93030

~ 18 min Onsite

BS in Chemical Engineering, Materials Science, Mechanical Engineering, Electrical Engineering, or closely related engineering discipline. An engineering degree is required - this position develops processes from first principles, not from existing recipes.
Typically requires 15+ years in microelectronics packaging, hybrid microcircuit assembly, or semiconductor device packaging.
Experience hands -on with at least 4 of the following: eutectic die attach (AuSn or AuGe), epoxy die attach, gold wire bonding, aluminum wire/ribbon bonding, hermetic seal processes (laser weld or seam weld), flip chip processes, substrate metallization/bonding, or MEMS/sensor packaging.
GaN experience: Direct experience with GaN-on-SiC power device packaging strongly preferred. Understanding of thermal management challenges in high-power RF amplifier packaging (50V, 200W+ dissipation, Tj max 175°C) is essential.
Experience transitioning microelectronic assemblies from R&D;/prototype through LRIP to production. Must be able to articulate specific NPI programs led, including process qualification methodology, FMEA development, and production readiness assessment.
Experience with MIL-PRF-38534 (hybrid microcircuits), MIL-STD-883, or equivalent military/space-grade manufacturing standards. Understanding of qualification flows, screening sequences, and lot acceptance testing.
Experience in materials characterization (SEM/EDS, XPS/ESCA, CSAM, X-ray, cross-sectioning) for root cause analysis of packaging failures. Experience leading RCCA investigations.
"This position requires you to have or obtain a government security clearance. Security clearances may only be granted to U.S. citizens."

SmartExplore AI is experimental.

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