Excellent manual dexterity and hand-eye coordination
Experience using tweezers, vacuum pencils, etc.
Strong understanding of microelectronics and the ability to work with delicate components.
Ability to work in a fast-paced, team-oriented environment.
Ability to read and interpret technical drawings and process specifications.
Minimum of 2 years of experience in a wire bonding or semiconductor manufacturing role.
Ability to wear the required Protective Equipment
Good communication skills, both written and verbal.
Carrying, Climbing, Crouching, Feeling, Foot Controls, Handling, Hearing, Kneeling, Lifting, Noise and/or vibration, Other, Pulling, Pushing, Reaching, Seeing, Stooping, Talking, Works Alone, Works Around Others
U.S. Export Controls Requirements: This job requires access to technology, materials, software or hardware that is controlled by the export laws of the United States. Candidates are required to provide proof of either US citizenship, Permanent US residency or classification as a protected individual as defined in 8 USC 1324b (a) (3).
Strong problem-solving skills and attention to detail.
Excellent visual capability to work with extremely small die, without magnification devices.
Proficiency with automated wire bonding machinery and manual wire bonding techniques.
You must be 18 years old with a high school diploma or GED
Able to lift, push, pull 25 lbs; carry 15 lbs; sit 10%; stand 60%; walk 40%; must be able to perform activities that include stooping, reaching, handling, hearing, talking, seeing, working alone and working around others.
High school diploma or equivalent; technical degree or certification in electronics, microelectronics, or a related field is preferred.
Regular and predictable attendance is essential