1238 Robotics Engineer jobs in Springfield,OH

Customer Service Rep Work From Home

Hire Standard Staffing

Springfield, OH

Adecco

Dayton, OH 45424

3–6 years of experience in a quality inspection or manufacturing environment
Strong knowledge of blueprint reading and GD&T;
Experience using inspection tools such as CMM, micrometers, and calipers
High attention to detail and strong problem-solving skills
Ability to communicate effectively and work in a team-oriented production environment
Ability to stand, walk, and perform inspections in a manufacturing setting

ConAgra Foods

Troy, OH 45373

Core-Mark

Springfield, OH 45502

High School Diploma/GED or Equivalent
6+ months of warehouse and/or distribution work experience
Must be able to work the scheduled / assigned times and required overtime for the position
Able to stand, walk, reach, and lift repeatedly throughout shift
Able to lift, stack, and/or pull products off shelves, as well as replenish product, from various heights weighing between 10-35 pounds and generally up to between approximately 60 and 90 pounds, depending on the location, throughout shift
Able to work in multi-temperature environments, i.e., cooler, freezer and dry
Pass post offer drug test and criminal background check

BOOZ, ALLEN & HAMILTON

Dayton, OH 45434

2+ years of experience in dynamic manufacturing and R & D environment evaluating new packaging materials, processes, and architectures to align to state-of-the-art
Experience in eCAD and mCAD sof tware
Experience with packaging, PCB fabrication, clea nro om processing, or SMT assembly
Experience developing packaging solutions that optimize Size Weight and Power ( SWaP ) and prototyping designs in a high-mix, low-volume R & D Environment
Experience operating and maintaining complex equipment in microelectronics rapid prototyping laboratories
Experience with the complete packaging assembly processes from concept to prototype including equipment and material selection for panel-level, wafer-level, and chip-level systems
Experience with flip-chip, BGA, WLP, system-in-package SiP, multi-chip modules MCM, panel level packaging, and heterogenous and chiplet integration
Ability to obtain a Secret clearance
Bachelor's degree in an engineering field